Hesse Fine Wire- and Heavy Wire Bonder

Quasys represents Hesse Mechatronics with its ultrasonic wire bonders for all wire sizes.

Hesse GmbH develops and manufactures ultrasonic wire bonders for all wire dimensions as well as ultrasonic flipchip bonders in combination with standardized or customized automation solutions.

For more information see the products below, go to http://www.hesse-mechatronics.com or  contact us

Bondjet BJ820 - High Speed Fully Automatic Fine Wire Wedge Bonder

The Bondjet BJ820 is the latest development of Hesse's wedge bonding innovation, responding to all wire bonding challenges on a single platform for a variety of applications such as RF and microwave devices, COB, MCM and hybrids, fibre-optics and automotive using aluminium wire, gold wire or ribbon. The BJ820 defines the benchmark in the industry for example by offering:

  • Largest work area 305 mm x 410 mm
  • High speed: up to 6 wires per second
  • Great axis accuracy: 1 μm bei 3 σ 
  • Wire size: Al, AU down to 12.5µm, ribbon up to 25µm x 250µm
  • Fine pitch < 40 µm
  • Piezo-technology bondheads
  • Vibration control
  • Backup and traceability system PBS200
  • Quality control by deformation, US-current or PiQC
  • E-Box: patented solution for optimized tool change and optical adjustment

Bondjet BJ935/BJ939 - Fully Automatic Heavy Wire Bonder

The Hesse GmbH as technology leader has designed the only heavy wire bondhead with non destructive pull test and a unique transducer integrated sensor for 100% quality monitoring in real-time. Further outstanding features are high speed and the largest bonding area. Advanced features available on Bondjet BJ935 and BJ939 are designed to meet your present and future requirements and greatly enhance productivity.

  • Largest work area: BJ935: 254 mm x 244 mm
    BJ939: 350 mm x 500 mm, option: 350 mm x 560 mm
  • Up to 3 wires per second
  • Great axis accuracy 
  • Wire size: 125µm up to 500µm (5mil - 20mil) for Al, Cu, ALCu (aluminium, copper, Al/Cu Hybrid),
  • Option: 75 μm up to 600 μm, Au
  • Ribbon 0,075 x 0,75 mm up to 0,3 x 2 mm
  • E-Box: patented solution for optimized tool change and optical adjustment
  • Active cutting system for highest cutting accuracy
  • Unique bondheads with integrated pull test
  • R&D cooperation with Infineon for IGBT, bonding of copper wire up to 500 µm

Bondjet BJ931 – Dual-Head Wedge Bonder

The High Speed Fully Automatic Dual-Head Wedge Bonder Bondjet BJ931 meets the latest technology and flexibility demands for automotive and power electronics applications, handling heavy aluminum, copper and gold wire and ribbon on two specialized bondheads that can be changed out in minutes.

  • Largest working area in the industry: 100 x 90 mm
  • Wire sizes: Al, AU: 75 µm up to 500 µm, Cu: 125 – 500 µm, ribbon:
  • 750 x 100 µm up to 2000 x 300 µm
  • Highest UPH due to linear motors for all axes!
  • E-Box: patented solution for optimized tool change and optical adjustment
  • Active cutting system for highest cutting accuracy
  • Unique bondhead’s with integrated pull test
  • Process integrated Quality Control (PiQC) for advanced quality monitoring

Flipjet FJ520 - Ultrasonic Flipchip-Bonder

The Flipjet FJ520 is the latest evolution of the Hesse GmbH flipchip bonder platform. The substantial experience of the Hesse GmbH in transducer development and ultrasonic technology, combined with the routine in building complex machines for fully automatic production has made this development possible. The FJ520 is designed with the flexibility for a wide range of applications and the possible requirements of future products in mind (e.g. 12").

  • Work area 200 x 250 mm
  • Multidimensional ultrasonic directions
  • Wafer size: 4” – 12” / wafer handling
  • Chip size: 0.2 x 0.2mm² up to 12 x 12mm²
  • ±3 µm repeated accuracy
  • Cycle time about 1.0 - 1.2 s
  • Finepitch down to 20 µm

Automation

The precise and safe handling of the products in and out of the production machine plays a significant role in controlling the product quality, yield and efficiency of the production equipment. For this reason Hesse GmbH is offering automation concepts individually adapted for every application. The portfolio of automation components for our machines consists of the following groups:

  • Transport system / Indexer
  • Bonding station / manual workholder and heat blocks
  • Magazine lifts
  • Visualization
  • MES interface

New 4" Feeder

A new 4" Stack feeder will be introduced at SMT in Nuremeberg. Click here to learn more.


Trade Fairs


Productronica Munich

November 14-17, 2016


APEX IPC Expo San Diego, CA

February 27 - March 1st, 2018


We moved!

Since March 11, 2015 you will find us at Rothusstrasse 5a, CH-6331 Hünenberg